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Semiconductor parts processing

Semiconductor component processing is not possible for precision machining of all materials. Some materials have a hardness that exceeds the hardness of the machining machine, which may cause the machine to break. Therefore, these materials are not suitable for precision machining, unless they are made of special materials or laser cut.

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Product Description Specification Parameters

Semiconductor component processing is not possible for precision machining of all materials. Some materials have a hardness that exceeds the hardness of the machining machine, which may cause the machine to break. Therefore, these materials are not suitable for precision machining, unless they are made of special materials or laser cut.

The materials used for precision machining of mechanical parts are divided into two categories: metallic materials and non-metallic materials.

For metallic materials, stainless steel has the highest hardness, followed by cast iron, copper, and ultimately aluminum.

The processing of ceramics, plastics, and other materials belongs to the processing of non-metallic materials.

1. Firstly, there is a requirement for the hardness of the material. In some cases, the higher the hardness of the material, the better. However, it is limited to the hardness requirements of the machined parts. The processed material cannot be too hard, assuming it is even harder than the machined parts, it cannot be processed.

2. Secondly, the material should have a moderate softness and hardness, at least one level lower than the hardness of the parts. It also depends on the purpose of the processed components and the reasonable selection of materials for the parts.

In short, precision machining still has certain requirements for materials, and not all materials are suitable for processing. For example, materials that are too soft or too hard are not necessary for processing, while the latter cannot be processed.

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